六名“00后”，创出芯片封装业国产“第一刀”

来自湖南城市学院的6名“00后”大学生，在学校和望城经开区支持下，成立了湖南科芯精工科技有限公司。他们研发出用于芯片封装的楔形劈刀并实现国产批量化生产，这一产品采用三项核心技术，以碳化钨为原料，性能优良且价格仅为进口产品的八分之一，还获得中国工程院院士高度评价，可广泛应用于多个领域。

Six students born after 2000 from Hunan City University, with the support of their college and Wangcheng Economic and Technological Development Zone, established Hunan Kexin Precision Technology Co., Ltd. They have developed a wedge bonding tool for chip packaging and achieved domestic mass production. This product utilizes three core technologies, uses tungsten carbide as the raw material, has excellent performance, and its price is only one - eighth of that of imported products. It has also received high praise from academicians of the Chinese Academy of Engineering and can be widely applied in multiple fields.

6人因参加国际大赛结识。创业过程中，他们得到了政府、学校和望城经开区的帮助，获得省政府创投基金、免费办公场地和专业指导。科芯精工不仅自身培养了一批工科人才，未来5年还可创造大量就业岗位，带动上下游千人就业。目前，他们在政策支持下努力发展，期望通过技术研发和工艺优化，成长为专精特新企业，助力区域经济发展。

The six students got to know each other when participating in an international competition. During the entrepreneurship process, they received assistance from the government, their college, and Wangcheng Economic and Technological Development Zone, obtaining venture capital funds from the provincial government, free office space, and professional guidance. Kexin Precision has not only cultivated a group of engineering talents but also is expected to create a large number of job positions in the next five years, driving the employment of thousands of people in the upstream and downstream industries. Currently, with the support of relevant policies, they are striving for development, hoping to grow into a specialized, sophisticated, differentiated and innovative (SRDI) enterprise and contribute to the development of the regional economy.